Yunfang Tin Industry's lead solder paste is made of scientific formula and low-oxidation spherical solder powder, which has superior environmental characteristics.With the characteristics of excellent dry resistance, good thixotropic properties, suitable for placement of fine pitch devices.
The film release performance is good during printing. After welding,less residual,small corrosion and extremely high surface insulation resistance value. Excellent ICT test performance can be achieved without cleaning. Yunfang Metals manufactures both types with different compositions likes in Lead-free Sn99.3Cu0.7, Sn99Ag0.3cu0.7, Sn96.5Ag3.0Cu0.5, Sn95Sb5, Sn42Bi58 in Leaded Solder Paste we have Sn63Pb37, Sn60Pb40, Sn55Pb45.
In continuous printing, the viscosity change is small, and the stability of the printing effect for a long time can be ensured. This product has excellent thixotropic properties, maintains good shape after printing, and it is not easy to collapse, which avoids offset of the chip components. The solder joints are bright after soldering and excellent electrical conductivity. There are fewer tin beads generated during soldering, which reduces the occurrence of short circuits.