YF-5H-0307 is designed for high-precision surface mount applications and is suitable for high-speed printing and placement lines. This product is made of low-silver alloy and is a cost-effective lead-free solder paste. Although the silver content is reduced, the welding effect comparable to SAC305 (high silver alloy) is still obtained with the combination of high-performance flux. The wide reflow window of YF-5H-0307 allows the solder paste to adapt to a variety of reflow profiles, ensuring uniform solder joints in different locations, especially for large PCBs.
YF-5H-0307 has better application stability than previous products. Under normal conditions of use (20-25 ° C, RH 30-60%), there is no significant change in viscosity and viscosity after continuous printing for 12 hours, and even in Good printing and soldering performance in harsh environments.
YF-5H-0307 residue after reflow is non-corrosive, colorless and transparent, no need to clean.