YF-H-03 lead-free medium temperature no-clean solder paste is made by mixing low-oxidation tin powder with high-efficiency flux in a vacuum environment. The solder paste is stable at room temperature and can release the activity rapidly when reflowed. The solder has good fluidity and strong wettability after melting. This solder paste can be widely used in thermal modules, LEDs, tuner and other products that require medium and low temperature soldering.
YF-H-03 does not contain any halogens. Although halogen is excluded from the formulation, the breakthrough formulation allows it to have excellent solderability and excellent wettability for OSP copper, HASL tin, silver or nickel pads, reflow soldering The light is full and black. The residue is colorless, transparent, non-corrosive and has the highest safety performance in the industry.
YF-H-03 has a wide reflow window and can adapt to a variety of reflow profiles. Solder joints of different endothermic parts can obtain good and consistent welding results.